2019 China Electronic Industry Product Packaging Summit Forum to Be Held in Shaoxing on September 18-20

The 2019 China Electronics Industry Product Packaging Summit Forum will be held in Shaoxing on September 18-20. Only 15 days remain until the registration deadline. This annual electronics packaging event - you only know how wonderful electronics packaging can be once you have been there!

September 18-20, Shaoxing, Zhejiang

2019 China Electronics Industry Product Packaging Summit Forum

Grandly opens!!!

Packaging industry representatives registered for the forum -

Zhejiang Xiwang Packaging, Qingdao Kaituo Technology, Huimeizhuang Group, Rongfeng Supply Chain, Jinsheng Packaging, Bendi Packaging, Shanghai Airbei, Foshan Tepugao, Asia-Pacific Packaging, Ningbo Xiyue, Jiangzhiyuan, Jiangnan University, Zhongshan Torch Polytechnic, Amcor International Containers, Reed Exhibitions, Adsale Exhibition, Huayin Media, Suzhou Dacheng, Hefei Dansheng, Tianjin Maohai, Wuhan Yadu, Shenzhen Prince Packaging, Hangzhou Pinxiang Technology, Dongguan Chuangwei, Dongguan Yuexing, Guangzhou Nanya, Yinuo Anti-rust, Huayuan New Materials, Ronghua Offset, Zhixin Packaging, Zhongju Packaging, Jiebao Biomass, Lilian Paper Products, Mingfeng Packaging, Zhiwei New Materials, Dongyuan New Materials, Cairun Packaging, Dongguan Tengliyuan, Wuhan Xintiandi, Wuxi Chengde Machinery, Xi'an Gaohui, Baolihui Honeycomb, Xingyi Packaging, Haifang Technology, Shangfeng Packaging, Lianhuan Packaging, Shengwei Packaging, Ruifeng Packaging, Zhidian Composite Materials, Hanrui Packaging, Panyu Huali, Runlin Packaging, Dongguan Huilin, Shenzhen Guangdayuan Film, Biaoneng Industrial, Hengtai Huaye, Xinxiangheng Packaging, Hongbo Century, Xiehelong, Foshan Fengyuan, Dongguan Chuangwei Adhesive Technology, Guangdong Lvsen Supply Chain, Shenzhen Beihua Plastics, Foshan Jiameili Packaging, Anhui Diweiluo, Xuzhou Tianchen Paper Products, Forest Packaging Group, Dongguan Yisheng Packaging, Zhongshan Senbao Paper, Hangzhou Lin'an Jinxing Packaging, Fujian Qinwei Optoelectronics, Shanxi Fenyang Xinghuacun Wenji Gift Box, Yongfa Henan Molding Technology, Liansheng Color Printing Group, Zhejiang Xinhengtai New Materials, Beijing Jingdong Longda Honeycomb, Anhui Jiecheng Packaging, Chaozhou Hongtu Printing, Jiangyin Weihang Paper, Changsha Jingda Printing Plate Making, Shantou Jinggong Dongjie Plate Making, Beijing Kaiteng Jinggong Plate Making, Zhongshan Shunguang Packaging, Woods Material Handling Products (Suzhou), Shenzhen Moma Technology, Manroland, Xunbaozhuang Network, Shanying International Xiangheng Creative Packaging, Henan Anti-counterfeiting and Confidential Printing Company, Ningbo Fushan Paper ......

(Registration is still in full swing...)

Note: The above list is in no particular order.

End-user enterprises registered for the forum -

China Star Optoelectronics, TCL Electronics, TCL Air Conditioner, Robam Appliances, AUX, Bade Kitchen & Bath, Vatti Corporation, Zhejiang Lianyi Motor, Galanz, Bull Group, Qingdao Topscomm Communication, Fujian Star-net Ruijie, Chigo Air Conditioning, Gree Electric Appliances, Yunnan China Tobacco, Midea Air Conditioning, Toshiba Logistics (Hangzhou), Midea Refrigerator, Midea Washing Machine, Chongqing Weibo Power Technology, Wingtech Technology, Midea Small Domestic Appliances,

, Midea Dishwasher, Fotile Kitchenware, Lenovo, Skyworth Air Conditioner, Skyworth TV, Melaleuca Nantong Health Technology, Hisense TV, Hisense Refrigerator, Xiamen Sanshuo Electronic Technology, Hisense Washing Machine, Shenzhen Megmeet, Yechu Commercial (Shenzhen), Shenzhen Zhimeida, OSRAM, Opple Lighting, CommScope, A.O. Smith, Wistron, Haier Air Conditioning, Cainiao Logistics, Haier Refrigerator, Haier TV, Foxconn Group, Inspur Group, Meige'er, Homa Refrigerator, ZTE Technology, Chint Electric, Changhong Group, Hikvision, Viomi Technology, Lanhe Technology, NetEase Yanxuan, Shanghai Packaging ......

(Registration is still in full swing...)

September 18

13:00-20:00 Delegate registration

September 19

Packaging Summit Forum

Moderator: Huang Shengwen

08:30-09:00 Forum opening, Huang Shengwen

09:00-09:15 Address by the leader of the Electronics Committee, Ye Baizhang

09:15-09:25 Address by the leader of Zhejiang Packaging Association, Association leader

09:25-09:35 Address by the leader of Zhejiang Xiwang Packaging, Company leader

09:35-10:00 Perspective on the annual keywords of electronics industry packaging, Huang Shengwen

10:00-10:25 Using new processes to reduce carton production costs, Xia Weilong

10:25-10:50 Fully automatic dry-end equipment solutions for corrugated board production lines, Cui Jinbao

10:50-11:15 Drop simulation analysis and effectiveness for packaged products, Lu Lixin

11:15-11:40 Haier's new requirements for green packaging in the new era, Lu Junfeng

11:40-12:00 Group photo of all delegates (at the hotel entrance), Xiwang Packaging

12:00-13:00 Lunch (business buffet, with meal voucher)

13:30-13:55 High-end printing technology boosts the great development of packaging enterprises, Kang Jianguo

13:55-14:20 Application trends of EPP in industrial packaging, Hu Yazhou

14:20-14:45 Under the plastic restriction order, paper packaging for home appliances sets off another green storm, Du Zhijian

14:45-15:10 A brief discussion of innovative applications, trends and demands of e-commerce packaging, Liu Jian

15:10-15:35 Moisture failure analysis and solutions for electronics industry products, He Xianpei

15:35-15:45 Tea break

15:45-16:10 A new packaging species - high-strength, low-cost suspended fastening film, Liu Mingfa

16:10-16:35 Carbon-emission-based optimization of green packaging design at Gree, Zhang Xiongfei

16:35-17:00 Intelligent inspection and quality big-data analysis for carton transport packaging, Su Hongbo

17:00-17:25 Application and business model of new environmentally friendly recycled pallets, Xia Zerong

17:25-17:50 Thoughts on packaging design and testing from an omnichannel supply chain perspective, Huang Changhai

18:30-20:30 Group dinner (Xiwang Night)

September 20

08:30-08:40 Forum opening session, Huang Shengwen

08:40-09:05 Total packaging solutions support the sustainable development of enterprises, Chen Shili

09:05-09:30 E-commerce logistics packaging solutions for home appliances, Zong Yuan

09:30-09:55 ---------------- Reserved for suppliers, end users on standby

09:55-10:20 ---------------- For

10:20-10:45 A new protection technology for home appliance packaging, Xiao Xiao

10:45-11:10 Failure analysis and solutions for hot-melt adhesive bonding of packaging materials, Che Jianlong

11:10-11:35 Automation development of packaging machinery becomes a trend, Yang Ying

11:35-12:00 The story of kitchen appliance packaging, Wang Yingjie

12:00-13:00 Lunch (business buffet, with meal voucher)

Packaging Hot Topics Salon

Moderator: Huang Shengwen

13:40-14:00 Salon opening, Huang Shengwen

14:00-17:00 Packaging Hot Topics Salon, Huang Shengwen, Zong Yuan

18:30-20:30 Group dinner (Kaituo Dinner)

08:30-11:30 Forum concludes, delegates check out and return

A detailed agenda

A tight schedule

Every activity has been

carefully considered and meticulously selected

We dare not waste a single second of the attending VIPs

If you are willing to come, we dare not slacken

Venue: New Century Grand Hotel Shaoxing, Zhejiang, China

——This article is reprinted from China Packaging Network (pack.cn). Original link: http://news.pack.cn/show-352904.html